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Compound Semiconductor Epitaxial Wafers
Applications - Laser Processing
Application Instructions
The core principle of laser processing is to utilize the extremely high energy density generated by focusing a high-brightness laser beam to act on materials through photothermal or photochemical effects, achieving the removal, connection, modification or addition of materials. Its core advantages lie in non-contact, high precision, high efficiency, high flexibility, wide material adaptability and ease of automation. These advantages make laser processing an indispensable key technology in modern manufacturing.